A novel deep reactive ion etched (DRIE) glass micro-model for two-phase flow experiments

A novel deep reactive ion etched (DRIE) glass micro-model for two-phase flow experiments.

In the last few decades, micro-models have become popular experimental tools for two-phase flow studies. In this work, the design and fabrication of an innovative, elongated, glass-etched micro-model with dimensions of 5 × 35 mm(2) and constant depth of 43 microns is described. This is the first time that a micro-model with such depth and dimensions has been etched in glass by using a dry etchi...

Deep Reactive Ion Etching (DRIE)

Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)

Wafer and die level uniformity effects in Deep Reactive Ion Etching (DRIE) are quantitatively modeled and characterized. A two-level etching model has been developed to predict non-uniformities in high-speed rotating microstructures. The separation of wafer level and die level effects is achieved by sequentially etching wafers with uniformly distributed holes. The wafer level loadings range fro...

A New Approach for Constructing Pore Network Model of Two Phase Flow in Porous Media

Development of pore network models for real porous media requires a detailed understanding of physical processes occurring on the microscopic scale and a complete description of porous media morphology. In this study, the microstructure of porous media has been represented by three dimensional networks of interconnected pores and throats which are designed by an object oriented approach. Af...

Die separation and rupture strength for deep reactive ion etched silicon wafers

The work herein analyzes the bending stress required to separate and rupture die from notched silicon wafers. Trenches are formed on the wafers using either a dicing or Bosch deep reactive ion etching (DRIE) process. Weibull distribution parameters are reported for all variations of the fracture experiments. Additionally, the relative defect rate associated with DRIE-based die separation are co...